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Calibration of the Disturbed State Model for Thermo-Mechanical Behavior of Various Solders

Dishongh, T. J. et al.

ASME -PUBLICATIONS- EEP.; Advances in electronic packaging 1999; Maui; HI, 1999; Jun, 1999, 433-440 -- ASME; 1999 Part: Part 1; (pages 433-440) -- 1999

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A Unified Constitutive Model Based on Disturbed State Concept and Multi-Domain Method for Design and Reliability in Electronic Packaging

Rassaian, M. et al.

ASME -PUBLICATIONS- EEP.; Advances in electronic packaging 1999; Maui; HI, 1999; Jun, 1999, 2031-2036 -- ASME; 1999 Part: Part 2; (pages 2031-2036) -- 1999

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Structural Reliability of PBGA Solder Joints With the Disturbed State Concept

Zwick, J. W. et al.

ASME -PUBLICATIONS- EEP.; Advances in electronic packaging 1999; Maui; HI, 1999; Jun, 1999, 1865-1874 -- ASME; 1999 Part: Part 2; (pages 1865-1874) -- 1999

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  1. Zwick, J. W.  (1)
  2. Whitenack, R.  (1)
  3. Dishongh, T. J.  (1)
  4. Rassaian, M.  (1)
  5. Lee, J.-C.  (1)
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by this Author/Contributor:

  1. Agonafer, D.
  2. Desai, C. S.
  3. Saka, M.
  4. Lee, Y. C.
  5. Zwick, J. W.

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