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A new binderless thick-film piezoelectric paste

Cotton, D. P. et al.

Journal of materials science. Materials in electronics. VOL 18; NUMBER 10, ; 2007, 1037-1044 -- Springer Science + Business Media (pages 1037-1044) -- 2007

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A simple route to form magnetic chitosan nanoparticles from coaxial-electrospun composite nanofibers

Wang, B. et al.

Journal of materials science. VOL 48; NUMBER 11, ; 2013, 3991-3998 -- Springer Science + Business Media Part 11; (pages 3991-3998) -- 2013

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Fundamental Limits of Organic Packages and Boards and the Need for Novel Ceramic Boards for Next Generation Electronic Packaging

Tummala, R. R. et al.

Journal of electroceramics. VOL 13; PART 1/3, ; 2004, 417-422 -- Springer Science + Business Media Part: Part 1/3; (pages 417-422) -- 2004

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by this Author/Contributor:

  1. Williams, G. R
  2. Tummala, R. R.
  3. Branford-White, C.
  4. Banerji, S.
  5. Quan, J.

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