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Result Number Material Type Add to My Shelf Action Record Details and Options
1
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Patent
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RF-MEMS Capacitive Switches With High Reliability

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2
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Patent
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Integrated optical transmitter and receiver

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3
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Patent
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Method of integrating MEMS device with low-resistivity silicon substrates

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4
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Patent
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METHOD OF INTERGRATING MEMS DEVICE WITH LOW-RESISTIVITY SILICON SUBSTRATES

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5
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Patent
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Wafer level interconnection

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6
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Patent
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WAFER LEVEL INTERCONNECTION

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7
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Patent
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Wafer level interconnection

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8
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Patent
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Wafer level interconnection

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9
Material Type:
Patent
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INTERCONNEXION AU NIVEAU PLAQUETTE
WAFER LEVEL INTERCONNECTION

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10
Material Type:
Patent
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INTERCONNEXION AU NIVEAU PLAQUETTE
WAFER LEVEL INTERCONNECTION

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by this Author/Contributor:

  1. Goldsmith Charles L
  2. Goldsmith Charles C
  3. Ables Billy D
  4. Ehmke John C
  5. Cheever James L

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