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Optimization of Heat Sink Geometries for Impingement Air-Cooling of LSI Packages

Kondo, Y.; Matsushima, H.; Ohashi, S.

Nihon Dennetsu Shimpojiumu koen rombunshu. VOL 33/PT3, ; 1996, 799-800 -- NATIONAL HEAT TRANSFER SYMPOSIUM OF JAPAN Part: Part; (pages 799-800) -- 1996

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Experimental Study of Impingement Cooling of Heat Sinks with Thin Plate Fins

Kondo, Y.; Matsushima, H.; Komatsu, T.

Nihon Dennetsu Shimpojiumu koen rombunshu. VOL 32//PT2, ; 1995, 399 -- NATIONAL HEAT TRANSFER SYMPOSIUM OF JAPAN Part: Part; -- 1995

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Experimental Study of Impingement Cooling of Heat Sinks with Thin Plate Fins

Kondo, Y.; Matsushima, H.; Komatsu, T.

Nihon Dennetsu Shimpojiumu koen rombunshu. VOL 32//PT2, ; 1995, 399 -- NATIONAL HEAT TRANSFER SYMPOSIUM OF JAPAN Part: Part; -- 1995

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Optimization of Finned Heat Sinks for Impingement Cooling of Electronic Packages

Kondo, Y. et al.

Journal of electronic packaging. VOL 120; NUMBER 3, ; 1998, 259-266 -- AMERICAN SOCIETY MECHANICAL ENGINEERS (pages 259-266) -- 1998

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Prediction Method for Air Cooling Performance of Notebook Size Electronic Equipment

Ohashi, S. et al.

SOCIETY FOR HYBRID MICROELECTRONICS Part: Part 9; (pages 116-121) -- 1996

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  1. Ohashi, S.  (2)
  2. Komatsu, T  (2)
  3. Behnia, M.  (1)
  4. Honma, M.  (1)
  5. Nakayama, W.  (1)
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by this Author/Contributor:

  1. Kondo, Y
  2. Matsushima, H.
  3. Ohashi, S.
  4. Komatsu, T
  5. Behnia, M.

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