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A Study on Low-temperature Bonding of Glass-Silicon using Modified Direct Bonding Method

Ju, B. K. et al.

TRANSACTIONS- KOREAN INSTITUTE OF ELECTRICAL ENGINEERS. VOL 46; NUMBER 3, ; 1997, 450-455 -- KOREAN INSTITUTE OF ELECTRICAL ENGINEERS Part: Part 3; (pages 450-455) -- 1997

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by this Author/Contributor:

  1. Kang, L. B.
  2. Samaan, N.
  3. Ko, C. G.
  4. Lee, Y.‐H.
  5. Haskard, M.

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