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Experimental Investigation of Planar Two-Arm Friction Assisted Grasping Tasks

Desai, J. P.; Kumar, V.; Rizzoni, G.

ASME -PUBLICATIONS- DSC.; Haptic interfaces for virtual environment and teleoperator systems; Dallas; TX, 1997; Nov, 1997, 29-36 -- ASME; 1997 (pages 29-36) -- 1997

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IMECE2005-79771 Heat Conduction in Three Dimensional Stacked Packages

Desai, A.; Geer, J.; Sammakia, B.

ASME -PUBLICATIONS- EPP.; Mechanical engineering; Electronic and photonic packaging, integration and packaging of micro/nano/electronic systems 2005; Orlando, FL, 2005; Nov, 2005, 467-472 -- ASME,; 2005 (pages 467-472) -- 2005

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IMECE2005-79732 Analytical Model of Heat Conduction in a Tubular Geometry With Application to a Nano-Structured Thermal Interface

Desai, A.; Geer, J.; Sammakia, B.

ASME -PUBLICATIONS- EPP.; Mechanical engineering; Electronic and photonic packaging, integration and packaging of micro/nano/electronic systems 2005; Orlando, FL, 2005; Nov, 2005, 425-432 -- ASME,; 2005 (pages 425-432) -- 2005

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Numerical Solution of Saturated Laminar Buoyant Jets

Gonzalez, J. E. et al.

ASME -PUBLICATIONS- HTD.; Mechanical engineering; San Francisco; CA, 1995; Nov, 1995, 321-330 -- ASME; 1995 Part: Part; (pages 321-330) -- 1995

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IMECE2003-41541 Prediction of Low Temperature Hot Corrosion Rate in Film Cooled Coal Fired Gas Turbines

Krishnan, V. et al.

ASME -PUBLICATIONS- HTD.; ASME International Mechanical Engineering Congress; Proceedings of the ASME Heat Transfer Division - 2003; Washington, D.C., 2003; Nov, 0, 45-54 -- New York; American Society of Mechanical Engineers; 2003 (pages 45-54)

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Computer Simulation of the Temperature Cycling Tests

Basaran, C. et al.

ASME -PUBLICATIONS- EEP.; Structural analysis in microelectronic and fiber optic systems; San Francisco; CA, 1995; Nov, 1995, 77-82 -- ASME; 1995 Part: Part; (pages 77-82) -- 1995

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Object-Orientedness and Large Scale Interoperability

Desai, S. et al.

ASME -PUBLICATIONS- PD.; Software systems in engineering; New Orleans; LA, 1994; Jan, 1994, 391-414 -- ASME; 1994 Part: Part; (pages 391-414) -- 1994

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8
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Unified Constitutive Modelling of Interfaces and Materials in Semiconductor Devices

Chia, J. H. et al.

ASME -PUBLICATIONS- EEP.; Structural analysis in microelectronics and fiber optics; New Orleans; LA, 1993; Nov, 1993, 113-126 -- ASME; 1993 Part: Part; (pages 113-126) -- 1993

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Silicon Microimplants: Fabrication and Biocompatibility

Desai, T. et al.

ASME -PUBLICATIONS- PD.; Materials and design technology 1995; Houston; TX, 1995; Jan, 1995, 97-102 -- ASME; 1995 Part: Part; (pages 97-102) -- 1995

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Calibration of the Disturbed State Model for Thermo-Mechanical Behavior of Various Solders

Dishongh, T. J. et al.

ASME -PUBLICATIONS- EEP.; Advances in electronic packaging 1999; Maui; HI, 1999; Jun, 1999, 433-440 -- ASME; 1999 Part: Part 1; (pages 433-440) -- 1999

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Results 1 - 10 of 12  for Everything in this catalogue

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