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Enhancement of the impact toughness in Sn–Ag–Cu/Cu solder joints via modifying the microstructure of solder alloy

Materials Letters, 15 March 2014, Vol.119, pp.20-23 [Peer Reviewed Journal]

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2
Growth mechanisms of interfacial intermetallic compounds in Sn/Cu-Zn solder joints during aging
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Growth mechanisms of interfacial intermetallic compounds in Sn/Cu-Zn solder joints during aging

Journal Of Materials Science, 2012 Sep, Vol.47(17), pp.6467-6474 [Peer Reviewed Journal]

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3
Impact crack propagation through the dual-phased (Cu,Ni)(6)Sn-5 layer in Sn-Ag-Cu/Ni solder joints
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Impact crack propagation through the dual-phased (Cu,Ni)(6)Sn-5 layer in Sn-Ag-Cu/Ni solder joints

Materials Letters, 2012 Aug 1, Vol.80, pp.103-105 [Peer Reviewed Journal]

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Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn–Ag–Cu solder joints

Materials Science & Engineering A, 08 September 2014, Vol.613, pp.193-200 [Peer Reviewed Journal]

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5
Suppressing the growth of Cu-Sn intermetallic compounds in Ni/Sn-Ag-Cu/Cu-Zn solder joints during thermal aging
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Suppressing the growth of Cu-Sn intermetallic compounds in Ni/Sn-Ag-Cu/Cu-Zn solder joints during thermal aging

Intermetallics, 2012 Jul, Vol.26, pp.11-17 [Peer Reviewed Journal]

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6
Interfacial Reaction of Sn and Cu-xZn Substrates After Reflow and Thermal Aging
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Interfacial Reaction of Sn and Cu-xZn Substrates After Reflow and Thermal Aging

Journal Of Electronic Materials, 2010 Feb, Vol.39(2), pp.230-237 [Peer Reviewed Journal]

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7
Improving the shear strength of Sn-Ag-Cu-Ni/Cu-Zn solder joints via modifying the microstructure and phase stability of Cu-Sn intermetallic compounds
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Improving the shear strength of Sn-Ag-Cu-Ni/Cu-Zn solder joints via modifying the microstructure and phase stability of Cu-Sn intermetallic compounds

Intermetallics, 2014 Nov, Vol.54, pp.181-186 [Peer Reviewed Journal]

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by this Author/Contributor:

  1. Yu, C.-Y.
  2. Yu, Cy
  3. Yu, Chi-Yang
  4. Duh, Jenq-Gong
  5. Duh, Jg

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