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v Modulus Conductive Adhesives Based on Metallized Polymer Spheres

Kristiansen, H.; Redford, K.; Taklo, M.M.V.

Advancing microelectronics / published by IMAPS--International Microelectronics and Packaging Society and Educational Foundation. VOL 36; NUMB 3, ; 2009, 8-11 -- IMAPS; 1998 Part 3; (pages 8-11) -- 2009

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Novel Conductive Adhesive Concept for Solar Module Manufacturing

Helland, S. et al.

European photovoltaic solar energy conference. 32nd Conference:Volume 1 (2016); pp 105-109 -- Curran Associates

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Crosslinking effect on the deformation and fracture of monodisperse polystyrene-co-divinylbenzene particles

He, J.Y. et al.

Express polymer letters. VOL 7, ; 2013, 365-374 -- BUDAPEST UNIVERSITY OF TECHNOLOGY & ECONOMICS Part; (pages 365-374) -- 2013

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Room-Temperature Curing and Grain Growth at High Humidity in Conductive Adhesives with Ultra-Low Silver Content

Pettersen, S. R. et al.

Journal of electronic materials. VOL 46; NUMBER 7, ; 2017, 4256-4266 -- Springer Science + Business Media

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Size effect on mechanical properties of micron-sized PS-DVB polymer particles

He, J. Y. et al.

Polymer. VOL 49; NUMBER 18, ; 2008, 3993-3999 -- Elsevier Science B.V., Amsterdam. (pages 3993-3999) -- 2008

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by this Author/Contributor:

  1. Kristiansen, H.
  2. Redford, K.
  3. Kalland, E.
  4. Fonnum, G.
  5. Helland, S.

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