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Radioactive seed localization and wire-guided localization in excision of non-palpable breast lesions

Li, Yun et al.

Zhongguo yixue yingxiang jishu. Volume 35:Number 2=Issue 309 (2019, February); pp 214-217 -- Zhongguo Yixue Yingxiang Jishu Bianjibu

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Solidification and grain refinement in Ti(48–50)Al2Mn2Nb1B alloys

Liu, Bo; Li, Jing; Hu, Dawei

Intermetallics. Volume 101: (2018, October); pp 99-107 -- Elsevier Science Pub. Co

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Solidification and grain refinement in Ti(48–50)Al2Mn2Nb1B alloys

Liu, Bo

Intermetallics. Volume 101 (2018, October); pp 99-107 -- Elsevier Science Pub. Co

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A new method for calculating the sonic conductance of airflow through a short-tube orifice

Yang, Fan et al.

Advances in mechanical engineering. Volume 9:Number 2 (2017) -- SAGE Publications Ltd

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Flexible and durable cellulose/MXene nanocomposite paper for efficient electromagnetic interference shielding

Hu, Dawei

Composites science and technology. Volume 188: (2020, March 1st) -- Elsevier Ltd

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Ferrite-based metamaterial microwave absorber with absorption frequency magnetically tunable in a wide range

Li, Wei et al.

Materials & design. Volume 110 (2016); pp 27-34 -- Elsevier Ltd

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Ferrite-based metamaterial microwave absorber with absorption frequency magnetically tunable in a wide range

Li, Wei et al.

Materials & design. Volume 110 (2016); pp 27-34 -- Elsevier Ltd

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Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: Microstructure, resistivity, oxidation resistance, and long-term stability

Li, Wanli

Journal of alloys and compounds. Volume 732: (2018, January 25th); pp 240-247

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Optically Transparent Broadband Microwave Absorption Metamaterial By Standing‐Up Closed‐Ring Resonators

Hu, Dawei et al.

Advanced optical materials. Volume 5:Issue 13 (2017); pp n/a-n/a -- Wiley-VCH Verlag GmbH & Co. KGaA

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Size-Controllable Synthesis of Bimodal Cu Particles by Polyol Method and Their Application in Die Bonding for Power Devices

Li, Wanli et al.

IEEE transactions on components, packaging, and manufacturing technology. Volume 8:Number 12 (2018, November 30th); pp 2190-2197 -- IEEE Components, Packaging and Manufacturing Technology Society

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