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Adhesion of chemical vapor deposited boron carbo-nitride to dielectric and copper films

Engbrecht, E. R. et al.

Journal of materials research. VOL 20; NUMB 8, ; 2005, 2218-2224 -- MRS MATERIALS RESEARCH SOCIETY (pages 2218-2224) -- 2005

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by this Author/Contributor:

  1. Ekerdt, J. G.
  2. White, J. M.
  3. Engbrecht, E. R.
  4. Fitzpatrick, P. R.
  5. Junker, K. H.

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