skip to main content
Show Results with:

Adhesion of chemical vapor deposited boron carbo-nitride to dielectric and copper films

Engbrecht, E. R. et al.

Journal of materials research. VOL 20; NUMB 8, ; 2005, 2218-2224 -- MRS MATERIALS RESEARCH SOCIETY (pages 2218-2224) -- 2005

Check library holdings

Notes here allow you and other users to comment and make notes on items, viewable by the whole community.
NB: Please use the Report Catalogue Error form to advise us of catalogue inaccuracies.

Log in to add a note

Tags allow you and others to define and search on related groups of items.

Log in to add / remove tags

Searching Remote Databases, Please Wait