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Fundamental Limits of Organic Packages and Boards and the Need for Novel Ceramic Boards for Next Generation Electronic Packaging

Tummala, R. R. et al.

Journal of electroceramics. VOL 13; PART 1/3, ; 2004, 417-422 -- Springer Science + Business Media Part: Part 1/3; (pages 417-422) -- 2004

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