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Prediction Algorithm of Thermal Resistance for Impingement Cooling of Heat Sinks for LSI Packages with Pin-Fin Arrays

Kondo, Y.; Matsushima, H.

HEAT TRANSFER JAPANESE RESEARCH. VOL 25; NUMBER 7, ; 1996, 434-448 -- JOHN WILEY & SONS LTD Part: Part 7; (pages 434-448) -- 1996

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