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11A Barrier Layers for Cu Interconnection - Barrier Properties and CMP

Hara, T.

INTERNATIONAL VLSI MULTILEVEL INTERCONNECTION CONFERENCE.; VLSI multilevel interconnection; Santa Clara, CA, 2000; Jun, 2000, 459-468 -- Institute Microelectronics Inter-On Chip Connection; 2000 (pages 459-468) -- 2000

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