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IMECE2005-79771 Heat Conduction in Three Dimensional Stacked Packages

Desai, A.; Geer, J.; Sammakia, B.

ASME -PUBLICATIONS- EPP.; Mechanical engineering; Electronic and photonic packaging, integration and packaging of micro/nano/electronic systems 2005; Orlando, FL, 2005; Nov, 2005, 467-472 -- ASME,; 2005 (pages 467-472) -- 2005

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