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Structural Reliability of PBGA Solder Joints With the Disturbed State Concept

Zwick, J. W. et al.

ASME -PUBLICATIONS- EEP.; Advances in electronic packaging 1999; Maui; HI, 1999; Jun, 1999, 1865-1874 -- ASME; 1999 Part: Part 2; (pages 1865-1874) -- 1999

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