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Impression creep behaviour of ultrasonically processed in-situ Al3Ti reinforced aluminium composite

Gupta, Rahul; Daniel, B.S.S.

MATERIALS SCIENCE AND ENGINEERING A. Volume 733: (2018, August 22nd); pp 257-266

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  • Title:
    Impression creep behaviour of ultrasonically processed in-situ Al3Ti reinforced aluminium composite
  • Author: Gupta, Rahul;
    Daniel, B.S.S.
  • Found In: MATERIALS SCIENCE AND ENGINEERING A. Volume 733: (2018, August 22nd); pp 257-266
  • Journal Title: MATERIALS SCIENCE AND ENGINEERING A
  • Subjects: Impression creep--Al-Al3Ti composite--Ultrasonication--Creep mechanism; Dewey: 620.11
  • Rights: Licensed
  • Abstract: Abstract The creep analysis of Al3Ti reinforced Aluminium composites with different weight percent of Al3Ti particles was carried out under stresses between 113 and 170 MPa and temperatures ranging from 543 to 603 K. The microstructure showed uniformly distributed micron scale Al3Ti particles throughout the matrix due to ultrasonic stirring. The presence of Al3Ti particles refined the microstructure of the composites as it promoted heterogeneous nucleation. The results obtained from creep analysis revealed that the composites had higher activation energy and stress exponent compared to the base alloy. The improved creep behaviour is attributed to the presence of homogeneously distributed Al3Ti particles in the aluminium matrix. The obtained stress exponent and activation energy values suggest that the main creep mechanism in the base Al alloy and Al3Ti reinforced composites was lattice diffusion-controlled dislocation climb. Highlights For the first time impression creep of ultrasonically prepared in-situ formed Al3Ti/Al composite is studied. Homogeneous and fine dispersion of Al3Ti is observed due to ultrasonic stirring. Presence of Al3Ti particle in the base Al alloy improve creep resistance. High stress exponent and activation energy of composites indicates better creep resistance as compared to base alloy. The operative creep mechanism is dislocation climb controlled by lattice diffusion.
  • Identifier: System Number: ETOCvdc_100085599394.0x000001; Journal ISSN: 0921-5093; 10.1016/j.msea.2018.07.017
  • Publication Date: 2018
  • Physical Description: Electronic
  • Shelfmark(s): 5396.430100
  • UIN: ETOCvdc_100085599394.0x000001

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