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Reliability of the 1st Level and the 2nd Level Inteconnections on the Flip Chip PBGA Package

Ahn, E.-C. Lee, Y.-M. Ryu, J.-H. Chung, T.-G. Oh, S.-Y.

International Society for Optical Engineering; 1999 (pages 839-844) -- 2002

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  • Title:
    Reliability of the 1st Level and the 2nd Level Inteconnections on the Flip Chip PBGA Package
  • Author: Ahn, E.-C. Lee, Y.-M. Ryu, J.-H. Chung, T.-G. Oh, S.-Y.
  • Found In: Proceedings of SPIE, the International Society for Optical Engineering. ISSU 4931, ; 2002, 839-844
  • Journal Title: Proceedings of SPIE, the International Society for Optical Engineering.
  • Subjects: LCC: S590; Dewey: 621.36
  • Publication Details: International Society for Optical Engineering; 1999
  • Language: English
  • Identifier: Journal ISSN: 0361-0748
  • Publication Date: 2002
  • Physical Description: Physical
  • Shelfmark(s): 6823.100000
  • UIN: ETOCRN121203480

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