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Influence of titanium oxide films on copper nucleation during electrodeposition

Chang, H. K.; Choe, B. H.; Lee, J. K.

Materials science & engineering. A, Structural materials : properties, microstructure and processing.; Micromechanics of advanced materials II: TMS 2005 Annual meeting in honour of James C. M. Li's 80th birthday; San Francisco, CA, 2005; Feb, 2005, 317-328 -- Elsevier; 2005 (pages 317-328) -- 2005

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  • Title:
    Influence of titanium oxide films on copper nucleation during electrodeposition
  • Author: Chang, H. K.;
    Choe, B. H.;
    Lee, J. K.;
    Yang, Fuqian;
    Li, James C. M.
  • Found In: Materials science & engineering. A, Structural materials : properties, microstructure and processing.; Micromechanics of advanced materials II: TMS 2005 Annual meeting in honour of James C. M. Li's 80th birthday; San Francisco, CA, 2005; Feb, 2005, 317-328
  • Conference Title: Materials science & engineering. A, Structural materials : properties, microstructure and processing.
  • Subjects: Micromechanics; Advanced materials
  • Publication Details: Elsevier; 2005
  • Language: English
  • Place Name: San Francisco, CA
  • Description: Also says the meeting was held in November 2004.
  • Identifier: Journal ISSN: 0921-5093
  • Publication Date: 2005
  • Physical Description: Physical
  • Shelfmark(s): 5396.430100
  • UIN: ETOCCN058385267

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