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Influence of Additives upon Nucleation and Growth of Copper on Titanium Substrates during Electrodeposition

Seol, K.-W. Choe, B.-H. Lee, Y.-K. Lee, J. K.; Sakai, T.

Materials science forum.; Processing and manufacturing of advanced materials; Thermec'2003; Madrid, 2003; Jul, 2003, 3715-3720 -- Trans Tech Publications; 2003 (pages 3715-3720) -- 2003

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  • Title:
    Influence of Additives upon Nucleation and Growth of Copper on Titanium Substrates during Electrodeposition
  • Author: Seol, K.-W. Choe, B.-H. Lee, Y.-K. Lee, J. K.;
    Sakai, T.
  • Found In: Materials science forum.; Processing and manufacturing of advanced materials; Thermec'2003; Madrid, 2003; Jul, 2003, 3715-3720
  • Conference Title: Materials science forum.
  • Subjects: THERMEC advanced materials processing manufacturing
  • Publication Details: Trans Tech Publications; 2003
  • Language: English
  • Place Name: Madrid
  • Identifier: Journal ISSN: 0255-5476
    Conference ISBN: 0878499199
  • Publication Date: 2003
  • Physical Description: Physical
  • Shelfmark(s): 5396.435700
  • UIN: ETOCCN048309392

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