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Calibration of the Disturbed State Model for Thermo-Mechanical Behavior of Various Solders

Dishongh, T. J. et al.

ASME -PUBLICATIONS- EEP.; Advances in electronic packaging 1999; Maui; HI, 1999; Jun, 1999, 433-440 -- ASME; 1999 Part: Part 1; (pages 433-440) -- 1999

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  • Title:
    Calibration of the Disturbed State Model for Thermo-Mechanical Behavior of Various Solders
  • Author: Dishongh, T. J.;
    Desai, C. S.;
    Agonafer, D.;
    Saka, M.;
    Lee, Y.-C.
  • Found In: ASME -PUBLICATIONS- EEP.; Advances in electronic packaging 1999; Maui; HI, 1999; Jun, 1999, 433-440
  • Conference Title: ASME -PUBLICATIONS- EEP.
  • Subjects: electronic packaging; photonic packaging; ASME; INTERPACK
  • Publication Details: ASME; 1999
  • Language: English
  • Place Name: Maui; HI
  • Description: Also known as INTERPACK '99
  • Identifier: Journal ISSN: 1524-9425
    Conference ISBN: 0791816125
  • Publication Date: 1999
  • Physical Description: Physical
  • Shelfmark(s): 1745.202533
  • UIN: ETOCCN031572504

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